Server AI accelerator inventory

How this inventory is compiled

We compile this catalog from NVIDIA, AMD, and Intel materials, including product, family, and architecture pages. The update date applies to the catalog as a whole; a linked page may provide broader product context rather than document every value in its row. Memory capacity, power limits, and form factors can vary by SKU or server platform, so confirm current model-specific documentation before selecting hardware. We omit street prices because these accelerators are generally sold through OEMs and partners rather than a consistent consumer retail channel.

Terms used in the table

HBM

High Bandwidth Memory, commonly used by data-center accelerators.

GDDR

Graphics Double Data Rate memory used on PCIe graphics cards.

SXM

NVIDIA server module form factor installed on a system baseboard.

OAM

OCP Accelerator Module form factor used in accelerator platforms.

PCIe

Peripheral Component Interconnect Express add-in card interface.

TBP

Typical Board Power, the stated power specification for the complete board.

TDP

Thermal Design Power, a cooling and power-design specification.